Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

Samsung Electronics is expected to more than double its output of HBM4 and HBM4E high-bandwidth memory chips next year, driven by a 2.5-fold increase in glass carrier demand—essential materials used in HBM production to prevent wafer damage during thinning. The company plans to increase outsourced glass carrier cleaning from 20,000 to 50,000 sheets monthly, with HBM4 family products projected to grow from 40% to 80% of Samsung's total HBM production mix as mass production of the advanced HBM4E chips accelerates.